Substrate processing apparatus

ABSTRACT

A development device has a plurality of nozzles and a plurality of pipes. The plurality of nozzles supply a processing liquid to a substrate. Each of the plurality of pipes is connected to one of the plurality of nozzles and supplies a processing liquid to a nozzle to which the pipe is connected. The development device includes a support and a cover member. The support supports portions of the plurality of pipes. The cover member contains part of the plurality of nozzles and the plurality of pipes while allowing supply of the processing liquid to substrates from the plurality of nozzles. When the support moves or rotates, the plurality of nozzles move between a processing position and a waiting position.

BACKGROUND Technical Field

The present invention relates to a substrate processing apparatus thatperforms processing on a substrate using a processing liquid.

Description of Related Art

Conventionally, a substrate processing apparatus is used to performpredetermined processing using a processing liquid on various substratessuch as a substrate for an FPD (Flat Panel Display) that is used for aliquid crystal display device, an organic EL (Electro Luminescence)display device or the like, a semiconductor substrate, a substrate foran optical disc, a substrate for a magnetic disc, a substrate for amagneto-optical disc, a substrate for a photomask, a ceramic substrateor a substrate for a solar cell.

As such a substrate processing apparatus, there is a development devicethat performs development processing on a photosensitive film using adevelopment liquid. For example, the development device includes a spinchuck that rotates a substrate while holding the substrate in ahorizontal posture, a nozzle that supplies a developing liquid onto thesubstrate and a cup provided so as to surround the substrate held by thespin chuck. During the development processing, a development liquid issupplied from the nozzle onto the substrate rotated by the spin chuck.The development liquid supplied onto the substrate during thedevelopment processing splashes around the substrate. A large portion ofthe development liquid splashing around the substrate is received to becollected by the cup.

The upper end of the cup is open. Therefore, part of the developmentliquid splashing from the substrate during the development processingmay splash from the upper end opening of the cup to the outside of thecup and adheres to the cup and its peripheral members. The developmentliquid adhering to the cup and its peripheral members causes generationof particles in the development device.

In order to suppress generation of particles in the development device,the development device described in JP 2002-246292 A includes a lid thatcloses the upper end opening of the cup. A slit into which a pluralityof development liquid supply nozzles can be inserted is formed in thelid. In the development device, the upper end opening of the cup isclosed by the lid with the substrate held by the spin chuck. Further, aplurality of development liquid supply nozzles are inserted into theslit of the lid, and the development liquid is supplied to the substraterotated by the spin chuck. Thus, because the development liquid issupplied from the plurality of development liquid supply nozzles to thesubstrate in the space closed by the lid and the cup, splashing of thedevelopment liquid above the cup during the development processing issuppressed.

SUMMARY

The development device described in JP 2002-246292 A includes aplurality of cleaning liquid supply nozzles in addition to the pluralityof above-mentioned development liquid supply nozzles. The plurality ofdevelopment liquid supply nozzles and the plurality of cleaning liquidsupply nozzles are held so as to be alternately arranged on an armextending in one direction. When the arm is moved up and down by themoving mechanism, the plurality of developing liquid supply nozzles andthe plurality of cleaning liquid supply nozzles are inserted into thelid from the outside of the lid through the slit. Further, the pluralityof development liquid supply nozzles and the plurality of cleaningliquid supply nozzles are drawn out from the inside of the lid to theoutside of the lid through the slit.

A plurality of pipes are respectively connected to the plurality ofdevelopment liquid supply nozzles and the plurality of cleaning liquidsupply nozzles. These pipes are respectively flexible so as to deform asthe arm moves. Therefore, when the plurality of pipes are respectivelydeformed in an unintended direction during fabrication or maintenance ofthe development device, handleability of the plurality of pipes isdegraded.

Further, in a case in which the degree of freedom in regard todeformation of the plurality of pipes is high, the plurality of pipesmay come into contact with one an other or the plurality of pipes rubagainst one another during movement of the arm. Such contact and rubbingof the plurality of pipes causes generation of particles and shorteningof lifetime of the plurality of pipes. In this case, cleanliness in theprocessing space of the development device is reduced, and thereplacement frequency of the plurality of pipes in the developmentdevice increases.

An object of the present invention is to provide a substrate processingapparatus that can improve handleability of a plurality of pipesconnected to a nozzle and reducing generation of particles andshortening of lifetime of the plurality of pipes caused by movement ofeach of the plurality of pipes with a high degree of freedom.

-   -   (1) A substrate processing apparatus according to one aspect of        the present invention includes a substrate holder that holds a        substrate, a plurality of nozzles that respectively supply a        processing liquid to a substrate held by the substrate holder, a        plurality of liquid pipes that are flexible, have first portions        respectively connected to the plurality of nozzles and supply a        processing liquid to the plurality of nozzles, a support that        supports the plurality of nozzles and supports the first        portions of the plurality of liquid pipes, a containing member        that is attached to the support and contains the plurality of        nozzles and the first portions of the plurality of liquid pipes        while allowing supply of a processing liquid to the substrate        from the plurality of nozzles, and a nozzles driver that moves        each of the plurality of nozzles between a processing position        above the substrate held by the substrate holder and a waiting        position outwardly of the substrate held by the substrate        holder.

In the substrate processing apparatus, because being contained in thecontaining member, the plurality of nozzles and the first portions ofthe plurality of liquid pipes can be handled integrally with thecontaining member. Therefore, handleability of the plurality of nozzlesand the plurality of liquid pipes in the substrate processing apparatusis improved.

Further, in a case in which the plurality of nozzles move between theprocessing position and the waiting position, the support moves orrotates. At this time, the plurality of nozzles and the first portionsof the plurality of liquid pipes connected to the nozzles are containedin the containing member. Thus, because the range in which the firstportions of the plurality of liquid pipes are deformable is limited tothe inside of the containing member, large deformation of each of thefirst portions of the plurality of liquid pipes during movement of theplurality of nozzles is suppressed. This reduces generation of particlesand shortening of lifetime of the plurality of liquid pipes caused bymovement of the plurality of respective pipes with a high degree offreedom.

-   -   (2) The support may be formed to extend linearly, the plurality        of nozzles may be attached to the support to be aligned in a        direction in which the support extends, and the containing        member may be formed to extend along the support.

In this case, the first portions of the plurality of liquid pipes can becontained in the containing member to extend in parallel with thesupport. This suppresses formation of large play in the plurality ofliquid pipes in the containing member. Further, the containing membercan be made compact.

-   -   (3) The support may include a plurality of nozzle fixing        portions to which the plurality of nozzles are respectively        fixed, and a first pipe fixing portion to which the first        portions of the plurality of liquid pipes are fixed while being        bound.

In this case, the first portions of the plurality of liquid pipes arefixed to the support by the plurality of nozzles fixed by the pluralityof nozzle fixing portions and the first pipe fixing portion of thesupport. Therefore, when the support moves or rotates, large deformationof each of the first portions of the plurality of liquid pipes issuppressed.

-   -   (4) The plurality of liquid pipes may respectively further have        second portions respectively extending from the first portions,        and the substrate processing apparatus may further include a        cylinder binder that is formed to bind the second portions of        the plurality of liquid pipes and cover the second portions of        the plurality of bound liquid pipes, and a second pipe fixing        portion to which the second portions of the plurality of liquid        pipes bound by the cylindrical binder are fixed.

In this case, handleability of the second portions of the plurality ofliquid pipes which are not fixed to the support is improved. Further,because the cylindrical binding member is flexible, a degree of freedomin regard to movement or rotation of the support is not limited.

-   -   (5) The substrate processing apparatus may further include a        chamber that has an inner space and contains the substrate        holder, the plurality of nozzles, the plurality of liquid pipes,        the support, the containing member and the nozzle driver in the        inner space, and a partition that partitions the inner space of        the chamber into a processing space including the substrate held        by the substrate holder and a non-processing space surrounding        at least part of the processing space with the substrate held by        the substrate holder, wherein the partition may include a        processing cup that is provided to surround a substrate held by        the substrate in a plan view and overlap with the substrate held        by the substrate holder in a side view, and forms the processing        space, a partition plate that is provided at a position above        the processing cup and has a nozzle opening formed to overlap        with the processing position in a plan view, and the containing        member may be configured to cover the nozzle opening while        allowing supply of a processing liquid from the nozzle to the        substrate with the substrate held by the substrate holder and        the plurality of nozzles located at the processing position.

In this case, when the plurality of nozzles are at the processingposition and the processing liquid is supplied to the substrate, thenozzle opening of the partition plate is covered by the containingmember. This reduces leakage of an atmosphere in the processing spacefrom the nozzle opening of the partition plate to the non-processingspace.

-   -   (6) The plurality of nozzles may include one or a plurality of        two-fluid nozzles that inject a fluid mixture including gas and        droplets of the processing liquid to the substrate held by the        substrate holder. In this case, it is possible to process the        substrate using a fluid mixture including gas and liquid.    -   (7) The substrate processing apparatus may further include one        or a plurality of gas pipes that supply gas to the one or        plurality of two-fluid nozzles, wherein the one or plurality of        gas pipes may have third portions respectively connected to the        one or plurality of two-fluid nozzles, and the third portions of        the one or plurality of gas pipes may be supported by the        support and contained in the containing member. In this case,        gas is supplied to the two-fluid nozzle.    -   (8) A processing liquid supplied from at least part of the        plurality of nozzles to the substrate may include an organic        solvent. In this case, it is possible to process the substrate        using a processing liquid using an organic solvent.

Other features, elements, characteristics, and advantages of the presentdisclosure will become more apparent from the following description ofpreferred embodiments of the present disclosure with reference to theattached drawings.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a schematic perspective view for explaining the schematicconfiguration of a development device according to one embodiment of thepresent invention;

FIG. 2 is a partially exploded perspective view for explaining theconfiguration of a liquid processing unit of FIG. 1 ;

FIG. 3 is a schematic plan view for explaining the configuration of partof the liquid processing unit of FIG. 2 ;

FIG. 4 is a schematic longitudinal cross sectional view for explainingthe configuration of part of the liquid processing unit of FIG. 2 ;

FIG. 5 is a perspective view of a nozzle arm unit of FIG. 2 ;

FIG. 6 is a longitudinal cross sectional view of the nozzle arm unittaken along a predetermined vertical plane;

FIG. 7 is an external perspective view of a partition plate and acylindrical member of FIG. 2 ;

FIG. 8 is a plan view of the partition plate and the cylindrical memberof FIG. 2 ;

FIG. 9 is a diagram for explaining the operation of the nozzle arm unitwhen a plurality of nozzles move between a waiting position and aprocessing position;

FIG. 10 is a diagram for explaining the operation of the nozzle arm unitwhen the plurality of nozzles move between the waiting position and theprocessing position;

FIG. 11 is a diagram for explaining the operation of the nozzle arm unitwhen the plurality of nozzles move between the waiting position and theprocessing position;

FIG. 12 is a diagram for explaining the operation of the nozzle arm unitwhen the plurality of nozzles move between the waiting position and theprocessing position;

FIG. 13 is a schematic longitudinal cross sectional view of thedevelopment device when a cup of the liquid processing unit is in afirst state;

FIG. 14 is a schematic longitudinal cross sectional view of thedevelopment device when the cup of the liquid processing unit is in asecond state;

FIG. 15 is a schematic longitudinal cross sectional view of thedevelopment device during development processing for a substrate;

FIG. 16 is a plan view showing one example of a nozzle opening of thepartition plate being covered by a cover member;

FIG. 17 is a longitudinal cross sectional view of the partition plate,the cylindrical member and the nozzle arm unit taken along the line K-Kof FIG. 16 ;

FIG. 18 is a block diagram showing the configuration of a controller ofthe development device 1 of FIG. 1 ; and

FIG. 19 is a flowchart showing the basic operation during thedevelopment processing for the substrate by the development device.

DETAILED DESCRIPTION

A substrate processing apparatus according to embodiments of the presentinvention will be described below with reference to the drawings. In thefollowing description, a substrate refers to a substrate for an FPD(Flat Panel Display) that is used for a liquid crystal display device,an organic EL (Electro Luminescence) display device or the like, asemiconductor substrate, a substrate for an optical disc, a substratefor a magnetic disc, a substrate for a magneto-optical disc, a substratefor a photomask, a ceramic substrate, a substrate for a solar cell orthe like.

A development device will be described as one example of the substrateprocessing apparatus. A substrate subjected to development processing inthe present embodiment has a main surface and a back surface. Further,in the development device according to the present embodiment, with themain surface of the substrate directed upwardly and the back surface ofthe substrate directed downwardly, the back surface (lower surface) ofthe substrate is held, and development processing is performed on themain surface (upper surface) of the substrate.

A photosensitive film on which exposure processing has been performed isformed at least in the center portion of the main surface of thesubstrate. This photosensitive film is a negative photosensitivepolyimide film, for example. As a development liquid for dissolving theexposed negative photosensitive polyimide film, an organic solventincluding cyclohexanone, cyclopentanone or the like is used. As a rinseliquid, an organic solvent including isopropyl alcohol, propylene glycolmonomethyl ether acetate (PGMEA) or the like is also used.

In the present embodiment, “development processing for a substrate”means dissolution of part of a photosensitive film by supply of adevelopment liquid to the photosensitive film which is formed on a mainsurface of a substrate after exposure processing is performed on thephotosensitive film.

<1> Configuration of Development Device

FIG. 1 is a schematic perspective view for explaining the schematicconfiguration of a development device according to one embodiment of thepresent invention. As shown in FIG. 1 , the development device 1basically has the configuration in which two liquid processing unitsLPA, LPB are contained in a casing CA. In FIG. 1 , the schematic shapesof the two liquid processing units LPA, LPB are indicated by the dottedlines. Details of the configuration of the liquid processing units LPA,LPB will be described below.

The casing CA has a substantially cuboid box shape extending in onedirection in a horizontal plane. Specifically, a first sidewall plate 1w, a second sidewall plate 2 w, a third sidewall plate 3 w, a fourthsidewall plate 4 w, a bottom plate 5 w and a top plate 6 w are attachedto a frame (not shown) to form the casing CA. In the followingdescription, a direction parallel to the direction in which the casingCA extends in a horizontal plane is suitably referred to as a firstdirection D1, and a direction orthogonal to the first direction D1 in ahorizontal plane is suitably referred to as a second direction D2. Thetwo liquid processing units LPA, LPB are arranged on the bottom plate 5w so as to be aligned in the first direction D1 in the casing CA.

The first and second sidewall plates 1 w, 2 w have a rectangular plateshape and are provided so as to be parallel to the vertical directionand the first direction D1 and face each other. The third and fourthsidewall plates 3 w, 4 w have a rectangular plate shape and are providedso as to be parallel to the vertical direction and the second directionD2 and face each other.

In the second sidewall plate 2 w, two carry-in carry-out ports ph fortransporting a substrate between the inside and outside of the casing CAare formed. The two carry-in carry-out ports ph are respectively formedin two portions opposite to the liquid processing units LPA, LPB in thesecond direction D2 in the second sidewall plate 2 w. In the top plate 6w, two openings op1 are formed to be aligned in the first direction D1.The aperture ratio of the two openings op1 in the top plate 6 w is setas sufficiently large as the aperture ratio of when the entire upper endof the casing CA is opened upwardly.

Two filters FL are provided above the top plate 6 w so as torespectively close the two openings op1 of the top plate 6 w. The twofilters FL may be provided immediately below the top plate 6 w. In FIG.1 , the two filters FL are indicated by the thick one-dot and dashlines. The two filters FL are ULPA (Ultra-Low Penetration Air) filters,for example, and are attached to a frame (not shown) that constitutesthe casing CA or the top plate 6 w. An air guide AG is provided on thetop plate 6 w of the casing CA so as to surround the two filters FL. InFIG. 1 , the air guide AG is indicated by the two-dots and dash lines.

A gas supplier 10 is provided outside of the casing CA. The gas supplier10 is an air control unit, for example, and regulates the conditions ofair such as a temperature and humidity so as to satisfy a predeterminedcondition during power-on of the development device 1. Further, the gassupplier 10 supplies air the conditions of which are regulated to theair guide AG through a duct DU. In this case, the air guide AG guidesthe air supplied from the gas supplier 10 to the two openings op1 of thetop plate 6 w through the two filters FL. Thus, a clean air thetemperature, humidity and the like of which are regulated is suppliedinto the casing CA, and a downward airflow is generated in an entireinternal space SP of the casing CA.

Two fluid suppliers 11 are further provided outside of the casing CA.Each fluid supplier 11 includes a development liquid supply source, arinse liquid supply source, a gas supply source and variousfluid-related elements and supplies a development liquid, a rinse liquidand gas to the liquid processing units LPA, LPB through a fluid supplypath 12. In FIG. 1 , the fluid supply path 12 is indicated by theone-dot and dash line. In the present embodiment, the fluid supply path12 is constituted by one or a plurality of pipes, a valve and the like.

The development device 1 further includes a controller 90. Thecontroller 90 includes a CPU (Center Processing Unit) and a memory, or amicrocomputer, for example, and controls the liquid processing unitsLPA, LPB and the two fluid suppliers 11. Details of the controller 90will be described below.

<2> Configuration of Liquid Processing Units (1) Outline ofConfiguration of Liquid Processing Units LPA, LPB

The two liquid processing units LPA, LPB of FIG. 1 basically have thesame configuration except that parts of constituent elements areprovided to be symmetrical to each other with respect to a plane(vertical plane) orthogonal to the first direction D1. The configurationof the liquid processing unit LPA out of the two liquid processing unitsLPA, LPB will be described below representatively. FIG. 2 is a partiallyexploded perspective view for explaining the configuration of the liquidprocessing unit LPA of FIG. 1 , FIG. 3 is a schematic plan view forexplaining the configuration of part of the liquid processing unit LPAof FIG. 2 , and FIG. 4 is a schematic longitudinal cross sectional viewfor explaining the configuration of part of the liquid processing unitLPA of FIG. 2 . In FIGS. 2 to 4 , a substrate W to be processed isindicated by the dotted lines.

As shown in FIG. 2 , the liquid processing unit LPA includes a partitionplate 100, a cylindrical member 200, a nozzle arm unit 300, a nozzledriver 400 and a waiting pod 500. Further, the liquid processing unitLPA further includes a cup 40, a lifting-lowering driver 49, a container50, an exhaust pipe 61, a drain pipe 62, a substrate holding device 70and a suction device 78. In FIG. 2 , in order to facilitateunderstanding of the structure of the plurality of constituent elements,parts of the constituent elements are shown in the upper field, and therest of the constituent elements is shown in the lower field.Specifically, in FIG. 2 , the parts of the constituent elementsincluding the partition plate 100, the cylindrical member 200, thenozzle arm unit 300, the nozzle driver 400 and the waiting pod 500 areshown in the upper field, and the rest of the constituent elementsincluding the cup 40, the container 50 and the substrate holding device70 is shown in the lower field. In FIGS. 3 and 4 , the schematic planview and the schematic longitudinal cross sectional view of the cup 40,the container 50 and the substrate holding device 70 are respectivelyshown as the partial configuration of the liquid processing unit LPA. Inthe partition plate 100 shown in FIG. 2 , a plurality of through holes H(FIG. 8 ), described below, are not shown.

(2) Cup 40 and Container 50

In the casing CA of FIG. 1 , the container 50 is fixed to the bottomplate 5 w (FIG. 1 ). As shown in FIG. 2 , the container 50 includes asidewall portion 51 and a bottom portion 52. The sidewall portion 51 hasan annular horizontal cross section, and is formed to extend in thevertical direction while having a constant inner diameter and a constantouter diameter. The bottom portion 52 is formed so as to close the lowerend of the sidewall portion 51.

Two through holes are formed in the bottom portion 52. The exhaust pipe61 is connected to the portion of the bottom portion 52 in which onethrough hole is formed. The exhaust pipe 61 guides an atmosphere in thecasing CA to an exhaust device (not shown) provided outside of thecasing CA. In the container 50, an end portion (opening end) of theexhaust pipe 61 is located farther upwardly than the bottom portion 52.

The drain pipe 62 is further connected to the portion of the bottomportion 52 in which the other through hole is formed. During thedevelopment processing for the substrate W, the drain pipe 62 guides theliquids (the development liquid and the rinse liquid) flowing from thecup 40 to a bottom portion of the container 50 to a drain device (notshown) provided outside of the casing CA as described below. In thecontainer 50, an end portion (opening end) of the drain pipe 62 islocated farther downwardly than the end portion of the exhaust pipe 61.

At least a lower portion of the substrate holding device 70 is containedin the container 50. Specifically, the substrate holding device 70includes a suction holder 71, a spin motor 72 and a motor cover 79 (FIG.4 ). In FIGS. 2 and 3 , the motor cover 79 is not shown. As shown inFIG. 3 , the spin motor 72 is fixed onto the bottom portion 52 so as tobe located at the center of the container 50 in a plan view. As shown inFIG. 4 , a rotation shaft 73 is provided at the spin motor 72 to extendupwardly. The suction holder 71 is provided at the upper end of therotation shaft 73. The suction holder 71 projects farther upwardly thanthe upper end of the container 50.

As shown in FIG. 2 , the suction device 78 is provided outside of thecontainer 50. The suction holder 71 is configured to be capable ofsucking the center portion of the back surface of the substrate W by anoperation of the suction device 78. The suction holder 71 sucks thecenter portion of the back surface of the substrate W, so that thesubstrate W is held in a horizontal posture at a position above thecontainer 50. Further, the spin motor 72 operates with the substrate Wheld by suction by the suction holder 71, so that the substrate W isrotated in a horizontal posture.

As shown in FIG. 4 , the motor cover 79 substantially has a bowl shape,and is fixed to the container 50 such that an open large-diameterportion is directed downwardly. A through hole into which the rotationshaft 73 is insertable is formed in the center portion of the upper endof the motor cover 79. With the rotation shaft 73 inserted into thethrough hole in the center portion of the upper end of the motor cover79, the motor cover 79 covers an upper end portion of the spin motor 72excluding the rotation shaft 73 and a space having a constant width andsurrounding the spin motor 72 in a horizontal plane from above. A gaphaving a constant width is formed between the outer peripheral end ofthe motor cover 79 and the inner peripheral surface of the sidewallportion 51.

Here, the above-mentioned end portion of the exhaust pipe 61 is locatedbelow the motor cover 79. This prevents the liquids (the developmentliquid and the rinse liquid) falling from above the container 50 fromentering the exhaust pipe 61 during the development processing for thesubstrate W.

As shown in FIG. 2 , at least the lower end of the cup 40 is containedin the container 50 in addition to the lower portion of the substrateholding device 70. Here, the cup 40 is configured to be movable in thevertical direction in the container 50. Further, the cup 40 includes acylindrical wall portion 41 and a liquid receiving portion 42. Each ofthe cylindrical wall portion 41 and the liquid receiving portion 42 hasan annular horizontal cross section and is provided to extend at leastin the vertical direction. As shown in FIG. 3 , the cup 40 is configuredto surround the substrate holding device 70 in a plan view.

As shown in FIG. 4 , the outer diameter and the inner diameter of theliquid receiving portion 42 gradually increase downwardly from the upperend of the liquid receiving portion 42. The outer diameter of the lowerend of the liquid receiving portion 42 (the largest outer diameter ofthe liquid receiving portion 42) is smaller than the inner diameter ofthe sidewall portion 51 of the container 50. Therefore, a gap having aconstant width is formed between the outer peripheral end of the liquidreceiving portion 42 and the inner peripheral surface of the sidewallportion 51. The cylindrical wall portion 41 has a constant innerdiameter and a constant outer diameter and is formed to extend upwardlyfrom the upper end of the liquid receiving portion 42.

As shown in FIG. 2 , the lifting-lowering driver 49 is provided in thevicinity of the container 50 in the casing CA of FIG. 1 . Thelifting-lowering driver 49 includes a driving mechanism such as a motoror an air cylinder, and changes the cup 40 between a first state and asecond state by supporting the cup 40 and vertically moving the cup 40.The first state and the second state of the cup 40 will be describedbelow.

(3) Nozzle Driver 400 and Waiting Pod 500

In the casing CA of FIG. 1 , the nozzle driver 400 is provided to beadjacent to the container 50 in the first direction Dl. The nozzledriver 400 includes a motor having a rotation shaft 401 and an actuator.The actuator includes an air cylinder, a hydraulic cylinder, a motor orthe like and supports the motor on the bottom plate 5 w (FIG. 1 ) suchthat the motor having the rotation shaft 401 is movable in the verticaldirection. The rotation shaft 401 is located at the upper end of thenozzle driver 400.

In the casing CA of FIG. 1 , the waiting pod 500 is further provided onthe bottom plate 5 w (FIG. 1 ). The nozzle driver 400 and the waitingpod 500 are aligned in the second direction D2 close to the container 50with a distance therebetween. The waiting pod 500 has a box shapeextending by a constant length in the second direction D2. A pluralityof waiting holes 510 (FIG. 10 ) for containing injecting portions 310 c(FIG. 6 ) of a plurality of nozzles 310 (FIG. 6 ), described below, areformed in the upper surf ace of the waiting pod 500.

A drain pipe (not shown) that drains liquid injected or falling from theplurality of nozzles 310 (FIG. 6 ) to the outside of the casing CA whenthe plurality of nozzles 310 (FIG. 6 ) are waiting is connected to thewaiting pod 500. Further, an exhaust pipe (not shown) that exhausts anatmosphere in the waiting pod 500 to the outside of the casing CA isconnected to the waiting pod 500.

(4) Nozzle Arm Unit 300

The nozzle arm unit 300 is attached to the upper end of the rotationshaft 401. The nozzle arm unit 300 has a longitudinal shape extendinglinearly in a direction different from the direction in which therotation shaft 401 extends while being attached to the 5 upper end ofthe rotation shaft 401. The nozzle arm unit 300 is mainly constituted bythe plurality (six in the present example) of nozzles 310, a support 320and a cover member 330.

FIG. 5 is a perspective view of the nozzle arm unit 300 of FIG. 2 , andFIG. 6 is a longitudinal cross-sectional view of the nozzle arm unit 300taken along the predetermined vertical plane (the vertical planeparallel to the direction in which the nozzle arm unit 300 extends). InFIG. 5 , the cover member 330 being separated from the rest of theconstituent elements is shown to facilitate understanding of theinternal structure of the nozzle arm unit 300.

The support 320 is fabricated by suitable bending of one metal platethat has been cut or laser-processed into a predetermined shape, forexample. Alternatively, the support 320 is fabricated by connection of aplurality of metal plates processed into a predetermined shape byscrewing, welding or the like. Further, the support 320 is formed toextend in one direction and has one end portion 321 and the other endportion 322. Further, the support 320 has three nozzle fixing portions323 which are aligned from the vicinity of the one end portion 321toward the other end portion 322 at intervals. Two nozzles 310 areattached to each of the three nozzle fixing portions 323. Further, thesupport 320 includes a pipe fixing portion 324 and two cover attachmentportions 325. The pipe fixing portion 324 is located in the vicinity ofthe other end portion 322. The pipe fixing portion 324 and the coverattachment portions 325 will be described below.

One of the two nozzles 310 provided at each nozzle fixing portion 323 isused to supply the development liquid to the substrate W. Further, theother one of the two nozzles 310 provided at each nozzle fixing portion323 is used to supply a rinse liquid to the substrate W. Further, eachof all of the nozzles 310 according to the present embodiment is a softspray-type two-fluid nozzle capable of injecting a fluid mixture ofliquid and gas. Therefore, each nozzle 310 has two fluid introducingportions 310 a, 310 b for introducing liquid and gas into the nozzle310, and an injecting portion 310 c for injecting a fluid mixture.

Each nozzle 310 is fixed to the support 320 with the injecting portion310 c directed downwardly. In this state, the fluid introducing portion310 a for introducing liquid into the nozzle 310 is provided at theupper end of each nozzle 310. Further, the fluid introducing portion 310b for introducing gas into the nozzle 310 is provided at a side portionof each nozzle 310.

One end of a pipe 311 for supplying liquid (the development liquid orthe rinse liquid in the present example) to the nozzle 310 is connectedto the fluid introducing portion 310 a of each nozzle 310. Further, oneend of a pipe 312 for supplying gas (a nitrogen gas in the presentexample) to the nozzle 310 is connected to the fluid introducing portion310 a of each nozzle 310. The pipes 311, 312 are formed of a flexibleresin material. Examples of such a resin material are PTFE(polytetrafluoroethylene), PVC (polyvinyl chloride), PPS (polyphenylenesulfide), PFA (tetrafluoroethylene-perfluoro alkyl vinyl ethercopolymer) and the like.

The other end portion 322 of the support 320 is attached to the upperend of the rotation shaft 401 of the nozzle driver 400. In this state, ahorizontal flat support surface SS is formed at the substantially centerportion in the longitudinal direction of the support 320. Part of eachof the plurality of pipes 311, 312 is provided so as to extend on thesupport surface SS from the nozzle 310 to which the pipe is connectedtoward the pipe fixing portion 324.

The pipe fixing portion 324 is constituted by part of the supportsurface SS. In the pipe fixing portion 324, the plurality of pipes 311,312 are bound. In this state, a pipe fixing piece 329 having an invertedU-shape is screwed onto the support surface SS constituting the pipefixing portion 324. Therefore, the plurality of pipes 311, 312 are fixedin the vicinity of the other end portion 322 of the support 320.Portions of the plurality of pipes 311, 312 extending outwardly of thesupport 320 from the pipe fixing portion 324 are contained in acylindrical binding member 391 while being bound. The cylindricalbinding member 391 is formed of rubber or resin, for example, and isflexible.

The cover member 330 has a box shape with an open bottom portion.Specifically, the cover member 330 of the present example includes anupper surface portion 331, one end-surface portion 332, anotherend-surface portion 333, one side-surface portion 334 and anotherside-surface portion 335. The upper surface portion 331 is an oblongthat is larger than a nozzle opening 110 (FIG. 7 ) of thebelow-mentioned partition plate 100 in a plan view. The one end-surfaceportion 332, the other end-surface portion 333, the one side-surfaceportion 334 and the other side-surface portion 335 extend downwardlyfrom the four sides of the outer edge of the upper surface portion 331.The one end-surface portion 332 and the other end-surface portion 333face each other, and the one side-surface portion 334 and the otherside-surface portion 335 face each other. A cutout 333N is formed in theother end-surface portion 333.

As described above, the support 320 has the two cover attachmentportions 325. The two cover attachment portions 325 are located at theupper end of the support 320. A screw hole is formed in each coverattachment portion 325. In the upper surface portion 331 of the covermember 330, through holes 331 h are formed in two portions correspondingto the two cover attachment portions 325 of the support 320.

With the plurality of nozzles 310 attached to the support 320, theplurality of pipes 311, 312 connected to the plurality of nozzles 310and the plurality of pipes 311, 312 fixed, the cover member 330 isattached to the support 320. Specifically, the two through holes 331 hof the cover member 330 are positioned on the two cover attachmentportions 325 of the support 320, and the cover member 330 is screwed tothe support 320.

Thus, a portion of the support 320 from the one end portion 321 to thevicinity of the other end portion 322 is covered by the cover member 330from above and the side. On the other hand, the remaining portion of thesupport 320 is drawn out through the cutout 333N formed in the otherend-surface portion 333 of the cover member 330. In this manner, thepart of the support 320 is contained in the cover member 330. Further,part of the plurality of nozzles 310 supported by the support 320 iscontained in the cover member 330. Further, part of the plurality ofpipes 311, 312 supported by the support 320 is contained in the covermember 330. In FIG. 5 , the cover member 330 being attached to thesupport 320 is indicated by the two-dots and dash lines.

Here, in the support 320, the pipe fixing portion 324 is located betweenthe other end portion 322 of the support 320 and the other end-surfaceportion 333 of the cover member 330. The pipe fixing piece 329 binds theplurality of pipes 311, 312 and fixes them to the pipe fixing portion324 such that the plurality of pipes 311, 312 drawn out from the covermember 330 do not come into contact with the inner edge of the cutout333N of the other end-surface portion 333.

As shown in FIG. 6 , with the cover member 330 attached to the support320, a large portion of each nozzle 310 except for the fluid introducingportion 310 a projects downwardly of the cover member 330.

(5) Partition Plate 100 and Cylindrical Member 200

FIG. 7 is an external perspective view of the partition plate 100 andthe cylindrical member 200 of FIG. 2 , and FIG. 8 is a plan view of thepartition plate 100 and the cylindrical member 200 of FIG. 2 . As shownin FIGS. 7 and 8 , the cylindrical member 200 has a cylindrical shapeand is fixed to part of the casing CA (FIG. 1 ) via a bracket (notshown). The inner diameter of the cylindrical member 200 is larger thanthe outer diameter of the cylindrical wall portion 41 (FIG. 3 ) of thecup 40. Further, the cylindrical member 200 is positioned such that thecenter axis of the cylindrical member 200 coincides or substantiallycoincides with the center axis of the cup 40 in a plan view. Thus, in acase in which the cup 40 is lifted, for example, it is possible toinsert the upper end of the cup 40 into the cylindrical member 200 whilepreventing the cup 40 from coming into contact with the cylindricalmember 200.

The partition plate 100 has a substantially disc shape and is attachedto the cylindrical member 200 so as to come into contact with the entireinner peripheral surface of the cylindrical member 200 in the vicinityof the upper end of the cylindrical member 200. The oblong nozzleopening 110 extending in the first direction D1 is formed in thesubstantially center portion of the partition plate 100. The nozzleopening 110 is opposite to the center portion of the substrate W held bythe substrate holding device 70 during the development processing forthe substrate W. As shown in FIG. 7 , a wall portion 111 extendingupwardly from the inner edge of the nozzle opening 110 by a constantlength (about 5 mm to 10 mm, for example) is formed in the portion ofthe partition plate 100 in which the nozzle opening 110 is formed.

As shown in FIG. 8 , a plurality of through holes H are formed in thepartition plate 100 so as to be dispersed over the entire partitionplate 100 except for the nozzle opening 110. The number and size of theplurality of through holes H formed in the partition plate 100 aredefined in consideration of the pressure relationship between aprocessing space Spa (FIG. 15 ) and a non-processing space SPb (FIG. 15), described below.

Specifically, in regard to the arrangement of the plurality of throughholes H, as indicated by the dotted lines in FIG. 8 , concentric circles(a plurality of virtual circles vc1) having a predetermined pitch aredefined on the basis of a partition plate center 100C in a plan view. Inthis case, the plurality of through holes H are dispersedly formed so asto be aligned at equal intervals on each virtual circle vol. Further,the number of through holes H formed on the largest virtual circle vc1among the plurality of virtual circles vc1 is larger than the number ofthrough holes H formed on each of the rest of the virtual circles vc1.Further, in the present example, only the largest virtual circle vc1among the plurality of virtual circles vc1 surrounds the entire nozzleopening 110. Therefore, in the largest virtual circle vc1, a pluralityof through holes H are formed so as to be aligned at constant intervalsover the entire virtual circle vol.

Further, as indicated by the thick two-dots and dash line in FIG. 8 , avirtual circle vc2 having a radius of ½ of the radius of the partitionplate 100 is defined with the partition plate center 100C as the center.Here, in a case in which the inner region of the virtual circle vc2 is acenter region A1, and the outer region of the virtual circle vc2 is anouter peripheral region A2, the number of the through holes H formed inthe outer peripheral region A2 is larger than the number of the throughholes H formed in the center region A1.

(6) Operation of Nozzle Arm Unit 300

As described above, the nozzle arm unit 300 is attached to the rotationshaft 401 of the nozzle driver 400. Therefore, when the motor of thenozzle driver 400 moves in the vertical direction, the nozzle arm unit300 moves in the vertical direction. Further, when the motor of thenozzle driver 400 is operated, the nozzle arm unit 300 rotates in ahorizontal plane around the rotation shaft 401. Thus, the plurality ofnozzles 310 of the nozzle arm unit 300 are held at a waiting position P1close to the substrate W held by the substrate holding device 70 in aperiod during which the developing processing is not performed on thesubstrate W. Further, the plurality of nozzles 310 are held at aprocessing position P2 above the substrate W held by the substrateholding device 70 in a period during which the developing processing isperformed on the substrate W. In FIG. 2 , the waiting position P1 andthe processing position P2 are respectively indicated by the outlinedarrows.

FIGS. 9 to 12 are diagrams for explaining the operation of the nozzlearm unit 300 when the plurality of nozzles 310 move between the waitingposition P1 and the processing position P2. In FIGS. 9 to 12 , thestates of the nozzle arm unit 300 and its peripheral members of when theplurality of nozzles 310 move from the waiting position P1 to theprocessing position P2 are shown in external perspective views in achronological order. In the partition plate 100 shown in each of FIGS. 9to 12 , similarly to the example of FIG. 2 , the plurality of throughholes H are not shown.

First, as shown in FIG. 9 , with the plurality of nozzles 310 located atthe waiting position P1, the nozzle arm unit 300 is located close to thepartition plate 100 and the cylindrical member 200 and held whileextending parallel to the second direction D2. At this time, the nozzlearm unit 300 is positioned such that the injecting portions 310 c (FIG.6 ) of the plurality of nozzles 310 are contained in the plurality ofwaiting holes 510 (FIG. 10 ) of the waiting pod 500.

When the nozzle driver 400 starts to operate in the state shown in FIG.9 , the nozzle arm unit 300 is lifted to a height position fartherupward than the cylindrical member 200 together with the rotation shaft401 as indicated by the thick solid arrow in FIG. 10 . Thus, theinjecting portions 310 c (FIG. 6 ) of the plurality of nozzles 310 aredrawn out from the plurality of waiting holes 510 (FIG. 10 ) of thewaiting pod 500.

Next, the rotation shaft 401 of the nozzle driver 400 rotates by apredetermined 20 angle (90° in the present example). Thus, the nozzlearm unit 300 rotates about the rotation shaft 401 as indicated by thethick solid arrow in FIG. 11 . Thus, the nozzle arm unit 300 is heldwhile extending parallel to the first direction D1. At this time, thenozzle arm unit 300 is positioned such that the cover member 330overlaps with the nozzle opening 110 of the partition plate 100 in aplan view.

Next, the rotation shaft 401 of the nozzle driver 400 is lowered. Thus,the cover member 330 is lowered as indicated by the thick solid arrow inFIG. 12 . At this time, the height position of the nozzle arm unit 300is adjusted such that the cover member 330 does not come into contactwith the partition plate 100 and is sufficiently close to the partitionplate 100. This reduces a flow of gas in the nozzle opening 110. In thismanner, with the nozzle opening 110 of the partition plate 100 coveredby the cover member 330, the plurality of nozzles 310 are held at theprocessing position P2.

Portions of the plurality of pipes 311, 312 extending outwardly from thenozzle arm unit 300 are bound by the cylindrical binding member 391. Asshown in FIGS. 9 to 12 , a fixing portion 392 for fixing part of thecylindrical binding member 391 to part (the bottom plate 5 w, forexample) of the casing CA is provided in the casing CA of FIG. 1 . Thefixing portion 392 fixes the part of the cylindrical binding member 391extending from the nozzle arm unit 300 to the casing CA. Thus, theplurality of pipes 311, 312 located between the nozzle arm unit 300 andthe fixing portion 392 are deformably bound by the cylindrical bindingmember 391. Therefore, handleability of the plurality of pipes 311, 312in the casing CA of FIG. 1 is improved. Further, because the cylindricalbinding member 391 is flexible, a degree of freedom in regard to each ofmovement and rotation of the nozzle arm unit 300 is not limited by thecylindrical binding member 391. The plurality of pipes 311, 312 bound bythe cylindrical binding member 391 are drawn out from the cylindricalbinding member 391 in the vicinity of the fixing portion 392 andconnected to the fluid supply path 12 of the fluid supplier 11 of FIG. 1.

(7) Operation of Cup 40

In the development device 1, the cup 40 is kept in the first state whenthe substrate W is carried into or carried out from the liquidprocessing unit LPA, LPB. On the other hand, during the developmentprocessing for the substrate W held by the substrate holding device 70,the cup 40 is kept in the second state. The first state and the secondstate of the cup 40 will be described.

FIG. 13 is a schematic longitudinal cross sectional view of thedevelopment device 1 when the cups 40 of the liquid processing unitsLPA, LPB are in the first state, and FIG. 14 is a schematic longitudinalcross sectional view of the development device 1 when the cups 40 of theliquid processing units LPA, LPB are in the second state. In FIGS. 13and 14 , each nozzle arm unit 300 located at the waiting position P1 isindicated by the dotted lines. Further, in FIGS. 13 and 14 , part of theplurality of constituent elements of the liquid processing units LPA,LPB is not shown.

As shown in FIG. 13 , when being in the first state, each cup 40 islocated in each container 50. That is, when being in the first state,the cup 40 overlaps with the container in a side view and are separatedfrom the cylindrical member 200. Therefore, when the cup 40 is in thefirst state, the substrate holding device 70 can be accessed from theside of the cup 40 and the container 50. Thus, the substrate W carriedin from the outside of the development device 1 can be placed on thesuction holder 71 of the liquid processing unit LPA, LPB. Further, thesubstrate W placed on the suction holder 71 of the liquid processingunit LPA, LPB can be taken out to be carried out from the developmentdevice 1.

The height (dimension in the vertical direction) of the cup 40 is setlarger than the distance between the cylindrical member 200 and thecontainer 50 in the vertical direction. As shown in FIG. 14 , when beingin the second state, the cup 40 overlaps with the lower end of thecylindrical member 200 and the upper end of the container 50 in a sideview. At this time, the upper end of the cup 40 and the inner peripheralsurface in the vicinity of the lower end of the cylindrical member 200are close to each other. Further, the lower end of the cup 40 and theinner peripheral surface in the vicinity of the upper end of thecontainer 50 are close to each other.

(8) Processing Space and Non-processing Space Formed in Casing CA

During the development processing for the substrate W, the cup 40 isheld in the second state, and the plurality of nozzles 310 of the nozzlearm unit 300 are arranged at the processing position P2. FIG. 15 is aschematic longitudinal cross-sectional view of the development device 1during the development processing for the substrates W. As shown in FIG.15 , during the developing processing for the substrates W, in each ofthe liquid processing units LPA, LPB, the plurality of nozzles 310 arearranged at the processing position P2 (FIG. 12 ), and the cover member330 covers the nozzle opening 110 of the partition plate 100. Thus, theinternal space SP of the casing CA is partitioned into the processingspaces SPa and the non-processing space SPb by the partition plates 100,the cylindrical members 200, the cover members 330, the cups 40 and thecontainers of the liquid processing units LPA, LPB. Each processingspace SPa is a space including the substrate W held by each substrateholding device 70, and the non-processing space SPb is a spacesurrounding the processing spaces SPa.

As indicated by the outlined arrows in FIG. 15 , clean air iscontinuously supplied to the non-processing space SPb from above.Further, part of the clean air supplied to the non-processing space SPbis supplied to the processing spaces SPa through the plurality ofthrough holes H (FIG. 8 ) of the partition plates 100. Thus, in thecasing CA, a downward flow of clean air is formed in each of the twoprocessing spaces SPa and the non-processing space SPb.

The inner peripheral surface of the liquid receiving portion 42 of thecup 40 forming each processing space SPa surrounds the substrate W heldby the substrate holding device 70 in a horizontal plane. Thus, largeportions of the development liquid and the rinse liquid supplied to thesubstrate W from the plurality of nozzles 310 during the developmentprocessing for the substrate W are received by the inner peripheralsurface of the liquid receiving portion 42 and guided to the container50. On the other hand, splashes of the development liquid or the rinseliquid that are not received by the liquid receiving portion 42 andsplash around the substrate W are guided to the container 50 by adownward airflow formed in the processing space SPa.

When the substrate W is rotated by the substrate holding device 70 inthe processing space SPa, an airflow (upward airflow) directed frombelow toward above may be generated along the inner peripheral surfacesof the cup 40 and the cylindrical member 200 in the vicinity of theperipheral edge of the substrate W. In this case, when an atmosphereincluding splashes of the development liquid or the rinse liquid islifted in the processing space SPa, these splashes may adhere to thelower surface of the partition plate 100 and the inner peripheralsurface of the cylindrical member 200. Further, these splashes mayre-adhere to the substrate W.

As such, as described with reference to FIG. 8 , in a case in whichconcentric circles are defined on the substrate W, the partition plate100 is fabricated such that the number of through holes H formed on thelargest virtual circle vc1 is larger than the number of through holes Hformed on each of the rest of the virtual circles vc1. Further, thepartition plate 100 is fabricated such that the plurality of throughholes H are dispersedly arranged at constant intervals over the entirelargest virtual circle vc1 surrounding the nozzle opening 110.Alternatively, in a case in which the center region A1 and the outerperipheral region A2 are defined on the partition plate 100, thepartition plate 100 is fabricated such that the number of through holesH formed in the outer peripheral region A2 is larger than the number ofthrough holes H formed in the center region A1.

With the above-mentioned configuration of the partition plate 100, inthe processing space SPa, an amount of a downward airflow guided to thevicinity of the inner peripheral surface of the cup 40 can be madelarger than an amount of a downward airflow guided to the center portionof the substrate W. In particular, in a case in which the plurality ofthrough holes H are dispersedly arranged at constant intervals over theentire largest virtual circle vc1 surrounding the nozzle opening 110, itis possible to form a downward airflow in the vicinity of the innerperipheral surface of the cup 40 over the entire circumference of theinner peripheral surface of the cup 40. This suppresses generation of anupward airflow in the vicinity of the inner peripheral surface of thecup 40 during rotation of the substrate W. Therefore, in the processingspace SPa, upward splashing of the development liquid or the rinseliquid supplied to the substrate W in the vicinity of the outerperipheral end of the substrate W is suppressed. As a result, adherenceof splashes of the development liquid or the rinse liquid to the lowersurface of the partition plate 100 and the inner peripheral surface ofthe cylindrical member 200 is suppressed. Further, re-adherence of thedevelopment liquid or the rinse liquid to the substrate W is suppressed.

As shown in FIG. 15 , in a case in which the processing spaces SPa andthe non-processing space SPb are formed in the casing CA, a differencebetween the pressure in each of the processing spaces SPa and thepressure in the non-processing space SPb is generated. The reason willbe described.

As described above, clean air is continuously supplied from above to theprocessing spaces SPa and the non-processing space SPb. However, anamount of a downward airflow that can enter the processing spaces SPafrom above the casing CA is limited by the partition plates 100.Further, in the development device 1, the end portion of the exhaustpipe 61 for exhausting an atmosphere in the casing CA is located in theinternal space of the container 50, that is, each processing space SPa.Therefore, an atmosphere in the processing space SPa is activelyexhausted to the outside of the casing CA.

On the other hand, in the non-processing space SPb, a member, such asthe partition plate 100, for limiting an amount of a downward airflow isnot provided. Further, in the non-processing space SPb, theconfiguration for actively exhausting an atmosphere in thenon-processing space SPb to the outside of the casing CA is notprovided. In particular, as shown in FIG. 15 , the bottom plate 5 w ofthe present example has closing portions cp that close thenon-processing space SPb from below the casing CA. Thus, part of airguided from above the casing CA to the non-processing space SPb is notexhausted to the outside of the non-processing space SPb due to theclosing portions cp. As a result, the pressure in the non-processingspace SPb is sufficiently higher than the pressure in each processingspace SPa.

Since the pressure in the non-processing space SPb surrounding theprocessing spaces SPa is higher than the pressure in each processingspace SPa, that is, the pressure in the processing space SPa is lowerthan the pressure in the non-processing space SPb, leakage of anatmosphere in the processing space SPa out of the casing CA through thenon-processing space SPb is suppressed.

Here, in a case in which the internal space SP of the casing CA ispartitioned into the processing spaces SPa and the non-processing spaceSPb, each cover member 330 desirably closes the nozzle opening 110 suchthat a flow of gas through the nozzle opening 110 is completely blocked.However, in a case in which the cover member 330 is repeatedly incontact and not in contact with the partition plate 100 each time thedevelopment processing for the substrate W is performed, particles maybe generated. Therefore, it is desirable that the cover member 330 doesnot come into contact with the partition plate 100.

As such, in the present embodiment, the cover member 330 covers thenozzle opening 110 without coming into contact with the partition plate100 during the development processing for the substrate W. The covermember 330 and the partition plate 100 are formed as described below soas to reduce a flow of gas in the nozzle opening 110 when the nozzleopening 110 is covered by the cover member 330.

FIG. 16 is a plan view showing one example of the nozzle opening 110 ofthe partition plate 100 being covered by the cover member 330, and FIG.17 is a longitudinal cross-sectional view of the partition plate 100,the cylindrical member 200 and the nozzle arm unit 300 taken along theline K-K of FIG. 16 . In FIG. 16 , the plurality of pipes 311, 312 arenot shown.

As shown in FIG. 16 , in a case in which covering the nozzle opening110, the cover member 330 is held such that the entire upper surfaceportion 331 (FIG. 5 ) covers the entire nozzle opening 110 in a planview. The plurality of end-surface portions and side-surface portions(332 to 335) of the cover member 330 are formed so as to surround theentire wall portion 111 of the partition plate 100 with a minute gaptherebetween in a plan view when the cover member 330 covers the nozzleopening 110.

As shown in FIG. 17 , the cover member 330 is held such that parts ofthe plurality of end-surface portions and side-surface portions (332 to335) overlap with the wall portion 111 of the partition plate 100 in aside view and does not come into contact with the partition plate 100.In FIG. 17 , an enlarged cross-sectional view of the lower end portionof the one end-surface portion 332 of the cover member 330 and itsvicinal portions is shown in the balloon.

As shown in the balloon of FIG. 17 , in a case in which the nozzleopening 110 is covered by the cover member 330, a gap space G is formedbetween the processing space SPa and the non-processing space SPb. Thegap space G is the space interposed between the wall portion 111 of thepartition plate 100 and the plurality of end-surface portions andside-surface portions (332 to 335) of the cover member 330. Thus, it ispossible to reduce a flow of gas in the nozzle opening 110 as comparedto a case in which the wall portion 111 is not formed in the partitionplate 100 or the cover member 330 is constituted by only the uppersurface portion 331. The distance (distance of the gap space G) betweenthe wall portion 111 of the partition plate 100 and the plurality ofend-surface portions and side-surface portions (332 to 335) of the covermember 330 in a plan view is preferably set to about 2 mm to 5 mm, forexample.

In the development device 1 according to the present embodiment, whenthe cup 40 is in the second state, the upper end of the cup 40 and theinner peripheral surface in the vicinity of the lower end of thecylindrical member 200 are close to each other. In this case, a gapspace is formed between the cylindrical member 200 and an upper portionof the cup 40. Thus, as compared to a case in which the cylindricalmember 200 is not present, a flow of an atmosphere in the processingspace SPa from between the cup 40 and the partition plate 100 into thenon-processing space SPb is reduced. The distance between the innerperipheral surface of the cylindrical member 200 and the outerperipheral surface of the cup 40 (the distance of the gap space betweenthe cylindrical member 200 and the upper portion of the cup 40) in aplan view is preferably set to about 2 mm to 5 mm, for example.

<3> Configuration of Controller of Development Device 1

FIG. 18 is a block diagram showing the configuration of the controller90 of the development device 1 of FIG. 1 . As shown in FIG. 18 , thecontroller 90 includes a first lifting-lowering controller 91, a fluidcontroller 92, a first rotation controller 93, a suction controller 94,a second lifting-lowering controller 95 and a second rotation controller96. The function of each element of the controller 90 of FIG. 18 isimplemented by execution of a predetermined program stored in a memoryby a CPU, for example.

The first lifting-lowering controller 91 controls the operation of thelifting-lowering driver 49 of the liquid processing units LPA, LPB.Thus, the cup 40 of each of the liquid processing units LPA, LPB changesto the first state or the second state. The fluid controller 92 controlsthe operation of the two fluid suppliers 11 of FIG. 1 . Thus, in each ofthe liquid processing units LPA, LPB, a fluid mixture of a developmentliquid and gas is injected from part of the plurality of nozzles 310,and a fluid mixture of a rinse liquid and gas is injected from the restof the nozzles 310.

The first rotation controller 93 controls the operation of the spinmotors 72 of the liquid processing units LPA, LPB of FIG. 1 . Further,the suction controller 94 controls the operation of the suction devices78 of the liquid processing units LPA, LPB of FIG. 1 . Thus, in eachsubstrate holding device 70, the substrate W is held by suction androtated in a horizontal attitude.

The second lifting-lowering controller 95 and the second rotationcontroller 96 control the operation of the nozzle drivers 400 of theliquid processing units LPA, LPB of FIG. 1 . Specifically, the secondlifting-lowering controller 95 controls the operation of an actuator ofeach nozzle driver 400. The second rotation controller 96 controls theoperation of a motor having the rotation shaft 401 of each nozzle driver400.

<4> Basic Operation of Development Device 1

The basic operation of the development device 1 will be described. FIG.19 is a flowchart showing the basic operation during the developmentprocessing for the substrate W1 performed by the development device 1.In an initial state, air the temperature, humidity and the like of whichare adjusted is supplied from the gas supplier 10 to the developmentdevice 1. Further, an atmosphere in the casing CA is guided to theexhaust device (not shown) from the exhaust pipes 61 of the liquidprocessing units LPA, LPB. A downward flow of clean air is formed in thecasing CA. Further, in the initial state, the cup 40 is held in thefirst state. Further, the plurality of nozzles 310 are held at thewaiting position P1.

Before the development processing for the substrate W is started, thesubstrate W to be processed is first carried into the liquid processingunit LPA, LPB. Further, as shown in FIG. 13 , the substrate W is placedon the suction holder 71 of the substrate holding device 70. When thedevelopment processing for the substrate W is started, the suctioncontroller 94 of FIG. 18 controls the suction device 78 of the liquidprocessing unit LPA, LPB such that the substrate W is sucked by thesuction holder 71 of the substrate holding device 70 (step S11).

Next, the first lifting-lowering controller 91 of FIG. 18 controls thelifting-lowering driver 49 of the liquid processing unit LPA, LPB suchthat cup 40 changes from the first state to the second state (step S12).

Next, the second lifting-lowering controller 95 and the second rotationcontroller 96 of FIG. 18 control the nozzle driver 400 of the liquidprocessing unit LPA, LPB such that the plurality of nozzles 310 movefrom the waiting position P1 to the processing position P2 (step S13).

Next, the first rotation controller 93 of FIG. 18 controls the spinmotor 72 of the liquid processing unit LPA, LPB such that the substrateW rotates about the rotation shaft 73 (step S14).

Next, the fluid controller 92 of FIG. 18 controls the fluid supplier 11of the liquid processing unit LPA, LPB such that a development liquid issupplied to the substrate W from part of the plurality of nozzles 310for a predetermined period of time (step S15). Further, the fluidcontroller 92 of FIG. 18 controls the fluid supplier 11 of the liquidprocessing unit LPA, LPB such that a rinse liquid is supplied to thesubstrate W from the rest of the plurality of nozzles 310 for apredetermined period of time (step S16).

Next, the first rotation controller 93 of FIG. 18 dries the substrate Wby continuing to rotate the substrate W until a constant period of timeelapses from the time when supply of the rinse liquid is stopped.Further, the first rotation controller 93 of FIG. 18 controls the spinmotor 72 of the liquid processing unit LPA, LPB such that the rotationof the substrate W is stopped after the constant period of time elapsesfrom the time when supply of the rinse liquid is stopped (step S17).

Next, the second lifting-lowering controller 95 and the second rotationcontroller 96 of FIG. 18 control the nozzle driver 400 of the liquidprocessing unit LPA, LPB such that the plurality of nozzles 310 movefrom the processing position P2 to the waiting position P1 (step S18).

Next, the first lifting-lowering controller 91 of FIG. 18 controls thelifting-lowering driver 49 of the liquid processing unit LPA, LPB suchthat cup 40 changes from the second state to the first state (step S19).

Finally, the suction controller 94 of FIG. 8 controls the suction device78 of the liquid processing unit LPA, LPB such that suction of thesubstrate W by the suction holder 71 of the substrate holding device 70is released (step S20). Thus, the development processing for thesubstrate W ends. The substrate W on which the development processinghas been performed is carried out from the liquid processing unit LPA,LPB.

<5>Effects

-   -   (1) In the above-mentioned development device 1, portions of the        plurality of nozzles 310 and the plurality of pipes 311, 312 are        contained in the cover member 330 while being supported by the        support 320. Thus, the portions of the plurality of nozzles 310        and the plurality of pipes 311, 312 can be handled together with        the cover member 330. Therefore, handleability of the plurality        of nozzles 310 and the plurality of pipes 311, 312 in the        developing device 1 is improved.

Further, in a case in which the plurality of nozzles 310 move betweenthe waiting position P1 and the processing position P2, the support 320is moved or rotated by the nozzle driver 400. At this time, becauseparts of the plurality of pipes 311, 312 are contained in the covermember 330, the range in which the portions of the plurality of pipes311, 312 can be deformed is limited to the inside of the cover member300. Therefore, large deformation of the portions of the plurality ofpipes 311, 312 during movement of the plurality of nozzles 310 issuppressed. This reduces generation of particles and a reduction inlifetime of the plurality of pipes 311, 312 caused by movement of theplurality of respective pipes 311, 312 with a high degree of freedom.

(2) In the nozzle arm unit 300, the support 320 is formed to extendlinearly. Further, the plurality of nozzles 310 are attached to thesupport 320 so as to be aligned in the direction in which the support320 extends. Further, the cover member 330 is formed so as to extendalong the support 320. Further, in the nozzle arm unit 300, theplurality of pipes 311, 312 extending from the plurality of nozzles 310are bound in the vicinity of the other end portion 322 of the support320 to be fixed to the pipe fixing portion 324.

In this case, portions of the plurality of pipes 311, 312 can becontained in the cover member 330 while extending along the support 320.This suppresses formation of large play in each of the plurality ofpipes 311, 312 in the cover member 330. Further, during movement androtation of the nozzle arm unit 300, large deformation of the portionsof the plurality of pipes 311, 312 located between the plurality ofnozzles 310 and the pipe fixing portion 324 of the support 320 issuppressed. Further, the cover member 330 can be made compact.

(3) An organic solvent included in a development liquid and a rinseliquid used in the development processing for the substrate W may have acharacteristic strong odor. In the above-mentioned development device 1,during the development processing for the substrate W, the internalspace SP of the casing CA is partitioned into the processing spaces SPaand the non-processing space SPb by the partition plate 100, thecylindrical member 200, the cover member 330, the cup 40 and thecontainer 50 during the development processing for the substrate W. Partof a downward airflow is guided to each processing space SPa through theplurality of through holes H of the partition plate 100. In this case,an amount of gas supplied to the processing space SPa can be madesmaller than an amount of gas supplied to the non-processing space SPb.Thus, the pressure in the processing space SPa can be made lower thanthe pressure in the non-processing space SPb.

In a case in which the pressure in the processing space SPa is lowerthan the pressure in the non-processing space SPb, an atmosphere in theprocessing space SPa is unlikely to enter the non-processing space SPb.Therefore, in a case in which being generated in the processing spaceSPa, an odor caused by a processing liquid is unlikely to leak to theoutside of the casing CA.

Further, in the above-mentioned configuration, the nozzle opening 10 isformed in the partition plate 100. With this configuration, theplurality of nozzles 310 do not interfere with the partition plate 100with the plurality of nozzles 310 located at the processing position P2.Further, with the plurality of nozzles 310 located at the processingposition P2, the nozzle opening 110 formed in the partition plate 100 iscovered by the cover member 330. Thus, when a development liquid or arinse liquid is supplied from the plurality of nozzles 310 to thesubstrate W, leakage of an atmosphere in the processing space SPa fromthe nozzle opening 110 to the non-processing space SPb is reduced.

As a result, degradation of comfort of a working environment around thedevelopment device 1 can be suppressed.

(4) In the above-mentioned development device 1, in each of the liquidprocessing units LPA, LPB, an atmosphere in the container 50 isexhausted to the outside of the casing CA through the exhaust pipe 61.On the other hand, the closing portions cp for closing thenon-processing space SPb from below the casing CA are provided at thebottom plate 5 w. Therefore, the pressure in the processing space SPacan be easily made lower than the pressure in the non-processing spaceSPb during the development processing for the substrate W.

<6> Other Embodiments

-   -   (1) In the development device 1 according to the above-mentioned        embodiment, an exhauster that exhausts an atmosphere in the        non-processing space SPb to the outside of the casing CA may be        provided at the bottom plate 5 w. In this case, during the        development processing for the substrate W, it is desirable to        control an amount of gas to be exhausted from each processing        space SPa and an amount of gas to be exhausted from the        non-processing space SPb such that the pressure in the        processing space SPa is kept lower than the pressure in the        non-processing space SPb.

(2) In the development device 1 according to the above-mentionedembodiment, as long as the pressure in each processing space SPa cankept lower than the pressure in the non-processing space SPb during thedevelopment processing for the substrate W, the partition plate 100 doesnot have to be provided.

(3) While being applied to the development device by way of example inthe above-mentioned embodiment, the present invention is not limited tothis. The present invention may be applied to a substrate processingapparatus that processes a substrate W by injecting or discharging fluidfrom a plurality of nozzles to the substrate W.

(4) While two substrates W are subjected to the development processingat the same time by the liquid processing units LPA, LPB contained inthe casing CA in the development device 1 according to theabove-mentioned embodiment, the present invention is not limited tothis. The development processing for the substrate W in the liquidprocessing unit LPA and the development processing for the substrate Win the liquid processing unit LPB may be performed at the same time orat different points in time.

For example, suppose that the development processing is performed on thesubstrate W in one liquid processing unit LPA (LPB) and the developmentprocessing is not performed on the substrate W in the other liquidprocessing unit LPB (LPA). In this case, in the one liquid processingunit LPA (LPB), the cup 40 is kept in the second state, and theplurality of nozzles 310 are held at the processing position P2.Further, in the other liquid processing unit LPB (LPA), the cup 40 iskept in the first state, and the plurality of nozzles 310 are held atthe waiting position P1. Thus, in the casing CA, the one processingspace SPa is formed in the one liquid processing unit LPA (LPB), and theinternal space of the other liquid processing unit LPB (LPA) is thenon-processing space SPb.

-   -   (5) In the partition plate 100 according to the above-mentioned        embodiment, the shape of the nozzle opening 110 is not limited        to the above-mentioned oblong. The nozzle opening 110 may be in        another shape such as an oval, a circle, a square, a triangle, a        tetragon, a pentagon or a hexagon. In this case, the cover        member 330 has the shape corresponding to the shape of the        nozzle opening 110 of the partition plate 100.    -   (6) While the cover member 330 covers the nozzle opening 110 so        as not to come into contact with the partition plate 100 with        the plurality of nozzles 310 located at the processing position        P2 in the development device 1 according to the above-mentioned        embodiment, the present invention is not limited to this. For        example, in a case in which generation of particles due to        contact and non-contact between the cover member 330 and the        partition plate 100 is suppressed by devising of a different        configuration or the like, the cover member 330 may close the        nozzle opening 110 while being in contact with the partition        plate 100. Alternatively, in a case in which generation of        particles due to contact and non-contact between the cover        member 330 and the partition plate 100 is suppressed to some        extent, the cover member 330 may close the nozzle opening 110        while being in contact with the partition plate 100.    -   (7) While each of the cup 40 and the cylindrical member 200        according to the above-mentioned embodiment has an annular        horizontal cross section, the present invention is not limited        to this. Each of the cup 40 and the cylindrical member 200 may        be configured to surround the substrate holding device 70 in a        plan view and may have a polygonal horizontal cross section.    -   (8) While the two liquid processing units LPA, LPB are provided        in the one casing CA in the development device 1 according to        the above-mentioned embodiment, the present invention is not        limited to this. In the casing CA, only one liquid processing        unit may be provided, or three or more than three liquid        processing units may be provided.    -   (9) While each of the plurality of nozzles 310 is constituted by        a two-fluid nozzle in the development device 1 according to the        above-mentioned embodiment, the present invention is not limited        to this. Each of the plurality of nozzles 310 may be a nozzle of        a type other than a two-fluid nozzle.    -   (10) While the cutout 333N is formed in the other end-surface        portion 333 in order to draw out part of the support 320 from        the cover member 330 in the cover member 330 according to the        above-mentioned embodiment, the present invention is not limited        to this. As long as the pressure in the processing space SPa can        be made lower than the pressure in the non-processing space SPb        during the development processing for the substrate W, the cover        member 330 does not have to have the other end-surface portion        333.

<7> Correspondences Between Constituent Elements in Claims and Parts inPreferred Embodiments

In the following paragraphs, non-limiting examples of correspondencesbetween various elements recited in the claims below and those describedabove with respect to various preferred embodiments of the presentdisclosure are explained.

In the above-mentioned embodiment, the substrate holding device 70 is anexample of a substrate holder, the plurality of nozzles 310 are anexample of a plurality of nozzles, the plurality of pipes 311 are anexample of a plurality of liquid pipes, portions of a plurality of pipes311 located in the nozzle arm unit 300 are an example of first portionsof a plurality of liquid pipes, the support 320 is an example of asupport, the cover member 330 is an example of a containing member, aprocessing position P2 is an example of a processing position, thewaiting position P1 is an example of a waiting position, the nozzledriver 400 is an example of a nozzle driver, and the development device1 is an example of a substrate processing apparatus.

Further, the plurality of nozzle fixing portions 323 of the support 320are an example of a plurality of nozzle fixing portions, the pipe fixingportion 324 of the support 320 is an example of a first pipe fixingportion, the portions of the plurality of pipes 311 located outside ofthe nozzle arm unit 300 is an example of second portions of a pluralityof liquid pipes, the cylindrical binding member 391 is an example of acylindrical binder, and the fixing portion 392 is an example of a secondpipe fixing portion.

The casing CA is an example of a chamber, the processing space SPa is an20 example of a processing space, the non-processing space SPb is anexample of a non-processing space, the partition plate 100, thecylindrical member 200 and the cup 40 are examples of a partition, thecup 40 is an example of a processing cup, the nozzle opening 110 is anexample of a nozzle opening, the partition plate 100 is an example of apartition plate, the plurality of pipes 312 are an example of one or aplurality of gas pipes, and the portions of the plurality of pipes 312located in the nozzle arm unit 300 are an example of a third portion ofone or a plurality of gas pipes.

As each of constituent elements recited in the claims, various otherelements having configurations or functions described in the claims canbe also used.

While preferred embodiments of the present disclosure have beendescribed above, it is to be understood that variations andmodifications will be apparent to those skilled in the art withoutdeparting the scope and spirit of the present disclosure. The scope ofthe present disclosure, therefore, is to be determined solely by thefollowing claims.

I/we claim:
 1. A substrate processing apparatus comprising: a substrateholder that holds a substrate; a plurality of nozzles that respectivelysupply a processing liquid to a substrate held by the substrate holder;a plurality of liquid pipes that are flexible, have first portionsrespectively connected to the plurality of nozzles and supply aprocessing liquid to the plurality of nozzles; a support that supportsthe plurality of nozzles and supports the first portions of theplurality of liquid pipes; a containing member that is attached to thesupport and contains the plurality of nozzles and the first portions ofthe plurality of liquid pipes while allowing supply of a processingliquid to the substrate from the plurality of nozzles; and a nozzlesdriver that moves each of the plurality of nozzles between a processingposition above the substrate held by the substrate holder and a waitingposition outwardly of the substrate held by the substrate holder.
 2. Thesubstrate processing apparatus according to claim 1, wherein the supportis formed to extend linearly, the plurality of nozzles are attached tothe support to be aligned in a direction in which the support extends,and the containing member is formed to extend along the support.
 3. Thesubstrate processing apparatus according to claim 1, wherein the supportincludes a plurality of nozzle fixing portions to which the plurality ofnozzles are respectively fixed, and a first pipe fixing portion to whichthe first portions of the plurality of liquid pipes are fixed whilebeing bound.
 4. The substrate processing apparatus according to claim 3,wherein the plurality of liquid pipes respectively further have secondportions respectively extending from the first portions, and thesubstrate processing apparatus further includes a cylinder binder thatis formed to bind the second portions of the plurality of liquid pipesand cover the second portions of the plurality of bound liquid pipes,and a second pipe fixing portion to which the second portions of theplurality of liquid pipes bound by the cylindrical binder are fixed. 5.The substrate processing apparatus according to claim 1, furthercomprising: a chamber that has an inner space and contains the substrateholder, the plurality of nozzles, the plurality of liquid pipes, thesupport, the containing member and the nozzle driver in the inner space;and a partition that partitions the inner space of the chamber into aprocessing space including the substrate held by the substrate holderand a non-processing space surrounding at least part of the processingspace with the substrate held by the substrate holder, wherein thepartition includes a processing cup that is provided to surround asubstrate held by the substrate in a plan view and overlap with thesubstrate held by the substrate holder in a side view, and forms theprocessing space, a partition plate that is provided at a position abovethe processing cup and has a nozzle opening formed to overlap with theprocessing position in a plan view, and the containing member isconfigured to cover the nozzle opening while allowing supply of aprocessing liquid from the nozzle to the substrate with the substrateheld by the substrate holder and the plurality of nozzles located at theprocessing position.
 6. The substrate processing apparatus according toclaim 1, wherein the plurality of nozzles include one or a plurality oftwo-fluid nozzles that inject a fluid mixture including gas and dropletsof the processing liquid to the substrate held by the substrate holder.7. The substrate processing apparatus according to claim 6, furthercomprising one or a plurality of gas pipes that supply gas to the one orplurality of two-fluid nozzles, wherein the one or plurality of gaspipes have third portions respectively connected to the one or pluralityof two-fluid nozzles, and the third portions of the one or plurality ofgas pipes are supported by the support and contained in the containingmember.
 8. The substrate processing apparatus according to claim 1,wherein a processing liquid supplied from at least part of the pluralityof nozzles to the substrate includes an organic solvent.